SOITEC attended this event and presented the REFERENCE PROJECT poster (see below).
The conference paper has been written by LMI. It is about Silicon deposition on 3C-SiC seeds of different orientations”
TUD attended the conference. M.Kreissig et al. ‘A Fully Integrated 2.6 GHz Cascode Class-E PA in 0.25 µm CMOS Employing New Bias Network for Stacked Transistors’
CEA has written 2 conference papers : The first one is about “A 130-nm SOI CMOS Reconfigurable Multimode Multiband Power Amplifier for 2G/3G/4G Handset Applications”. The second one is …
2 conference papers have been written by CEA. The first one is about “Broadband SOI PA with Tunable Matching Network for Improved LTE Performances Under High VSWR. “. The …
SOITEC attended the conference. Topic : RF Performance of Passive Components on State-of-Art Trap Rich Silicon on-Insulator Substrates.
It was carried out by E.Desbonnets from SOITEC. Topic : Engineered silicon on insulator substrates and others structures to support Communication road map up to 5G. Eric Desbonnet, Seoul
Topic of the day « Amplificateurs de puissance pour applications 5G » : A Reconfigurable Multimode Multiband PA in RF SOI Technology. It was carried out by CEA-leti
It was carried out by NANIUM.
It was carried out by SOITEC. BOSH and AUDI was present.